Capital Electro-Circuits, Inc.  
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Summary of Capabilities  
 

 SERVICES:

    Manufacture PWBs
  • on Time Delivery
  • Stringent DRC/DFM Customer Documentation Review
  • Any Product Type, Volume or Time Frame
  • Parallel Prototyping
  • PWB Design (Analog, Digital, RF and Microwave)
  • Supply Chain management
  • Stocking and JIT Programs
  • Reverse Engineering
  • Speciality jobs outside of the standard PCB Fabrication
  • Assembly

    • Delivery Options - Offering delivery times to meet your needs.
  • Quick Turns - 24 Hours to 5 Days
  • Standard lead time from 2 to 4 weeks
  • Scheduled deliveries on production available
  • High volume quantities & deliveries available
  • UL Approved

PRODUCTS:

  • Unclad Printed Circuit Boards (PCB's)
  • Single sided PCBs
  • Double Sided PCBs
  • Multilayer (Up to 22 Layers) PCBs
  • RF and Microwave PCBs
  • Flex and Rigid-Flex
  • Commercial, Medical, Automotive, Military, Defense, Aerospace, Telecom, Satellite Etc. PCBs
  • Metal Backed Printed Circuit Boards- ( Al, Cu, Brass) Post & Pre Bonding.
  • Heavy Copper weights ( Up to 10 oz) PCBs.
  • Large Printed Circuit Boards (Up to 23 Inches X 29 Inches), Long Antennas, Power Strips, Power Supplies, Back Plating.
  • Specialty Materials ( Rogers, Taconic, Arlon, Neltec, Isola Etc).
  • Thermal Clad Printed Circuit Boards- High Intensity/Performance LED
  • Very High Volt PCB
  • Very Thick PCBs
  • Castellation Holes (Half Moon PTHS)
  • Edge/Cavity Plating
  • Blind/Buried vias
  • RF-Teflon 1 layer to 14 layers
  • Controlled impedance
  • Solder mask over bare copper (SMOBC)
  • Selective or deep nickel/gold plating (hard, soft, immersion type gold finish)
  • SMT (Surface Mount Technology) & BGA (Ball Grid Array)
  • Plugged vias ( Conductive Epoxy Filled or Non Conductive)
  • Lines and spacing down to 3 mils
  • Drill capabilities down to .008
  • Fine pitch SMT down to 10 mils pitch
  • Scoring- V-groove jump scoring
    		•  
     
      CAPABILITIES:

    Material Capabilities:
    Min finished thickness D/S 003
    Min finished thickness M/L .010
    Max finished thickness .500
    Min I/L core thickness .002
    Min dielectric thickness .001
    Finished thickness tolerance +/- 10%
    Copper weights available (base/foil) 1/2,1, 2, 3, 4 oz
    Copper Cladding:
  • Inner layer maximum Cu weight: 4oz
    - Outer layer maximum Cu weight: 10oz
    - Minimum Cu weight :1/2 oz
  • Panel size: Max available panel size:24" X 30"

    • Material
    Laminate Type:
  • Lead free alternative High Tg laminates: - Polyclad FR-250HR (Tg = 150 C), PCL-FR-370HR (180 C), PCL-LD-621 (210 C)
  • Teflon (Rogers, Taconic, Arlon, Nelco)
  • Standard FR4, FR406, FR408, BT
  • CEM-1, CEM-3
  • Polyimides
  • GETEK
  • Ceramic of various types Example TMM 10, TMM 6

    • Rogers Corporation:
  • Non-Woven and Woven PTFE
  • R/T duriodR 5880 5870 6002 6006 6010 R03200TM series RO3200TM series ULTRALAM1000 ULTRALAM2000 Non PTFE Ceramic filled RO4000 RO4350 TMM3 TMM4 TMM6 TMM10 TMM10I

    • Tocanic/Arlon Microwave Materials
  • Woven PTFE
  • 85 N- Pure Polyimide
  • DiCladR (Co-piled) and CuCladR (Crosssplied)
    Commercial Grade AR 320R
    Ceramic Filled PTFE
    DiClad 810R AR350R/AR1000R CLTER
  • Non Woven PTFE
  • IsoClad 900 Series
  • Taconic Advanced Dielectric Division
  • TLY TLX TLE TLC, TLT, RF-35

    • Aluminum/Brass/Copper Heat Sink Circuits
  • RF Telecommunication (500 MHz to 100 GHz) Complex board shapes fabricated using CNC routing, milling Machining tolerances: ±.005", down to ±.001" Aluminum-backed PTFE circuit with nickel and gold plating on both copper circuitry and aluminum
  • Single and double-sided circuits with thermally conducting electrically insulating bonding film (Thermasil) between circuitry and heat sink base. Copper circuitry with various Cu thicknesses and final finish can be bonded with Al of various types and thickness. For heat management applications: Power supplies, Automotive electronics including LEDs, Computers, Motor controls, and Power semiconductors

    • CAM:
  • Pre-CAM DRC Analysis
  • CAM-controlled Panelization with DFM
  • Extracted Net-list Comparison

    • DRILLING & PLATING:
  • Max. Aspect Ration: 12 to 1
  • Min. hole size tolerance (plated):+ .003" Min hole size tolerance (unplated): +.0015"
  • Min. drilled hole size: .008
  • Maximum drilled hole size: 250 mil
  • Min. annular plane clearance of drilled hole: .010"
  • Min. internal pad size to drill hole size: +.012"
  • Min. external pad size to drill hole size: +.010"


    • Multilayer Constructions:
  • Minimum core thickness: .002"
  • Maximum layer count: 22
  • Blind/buried vias – sequential lamination

    • Fabrication
  • Scoring - CNC (jump scoring available); Web Routing: available
  • Edge milling
  • Hard-tool Pierce and /or Blank
  • Edge beveling
  • Minimum slot width:.020"
  • Min. inside radius (milled): .015"
  • Min. Distance of Plated Hole to internal Trace or Plane .0075"
  • Min. Distance of Non-Plated Hole to internal Trace or Plane: Internal: .0075", External .006"
  • Standard finished Minimum Annular Ring is .001", if not specified.
  • Min. Pad to Drill Hole Size: Internal .010", External .008"
  • Min. Plane Clearance to Drill Hole: .020"
  • Min. Drilled Hole Size: .008"

    • Etching/Imaging:
  • Minimum conductor width:

    • Start Cu Foil weight Internal External
    0.5 oz.                   .003" .004"
    1.0 oz.                   .004" .006"
    2.0 oz.                   .008" .010"
    3.0 oz.                   .010" .012"
  • Minimum feature spacing

    • Start Cu Foil weight Internal External
    0.5 oz.                   .003" .004"
    1.0 oz.                   .005" .006"
    2.0 oz.                   .006" .0075"
    3.0 oz.                   .008" .010"
  • Min SMT pitch .012"
  • Min I/L clearance to finished hole size .012"
  • Min O/L pad to finished hole size .014"
  • Registration tolerance (top to bottom) +/- .002"

    • LPI Soldermask/Legend:
    Soldermask registration tolerance +/- .0025"
    Min soldermask clearance .002"/Pad or SMT Feature
    Soldermask conductor overlap .003" over conductor edge
    Min soldermask dam/web thickness     .004"
    Min legend aperture .004"
    Min legend font height .007"
    Min distance from pad or SMT feature     .005"
    Final Finish
  • SMOBC (Solder Mask Over Bare Copper)
  • HASL - Hot Air Solder Level
  • Lead Free Hot Air Level
  • ENIG - Electroless Nickel / Immersion Gold
  • Palladium- Electroless
  • Hard Gold over Nickel Edge Connectors Nickel - Electrolytic
  • Electrolytic Soft gold and Electrolytic Nickel
  • Immersion Tin
  • Immersion Silver
  • OSP - Organic Solderable Preservative
  • Carbon ink - switch pads

    • ELECTRICAL TEST:
    Min SMT pitch .012"
    Min continuity 10 Ohm
    Min isolation 10 M Ohm
    Voltage range available 10-250 VDC
    Controlled impedance tolerance +/- 10%
    		 
         
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